CG-BGA-5023 Datasheet, PDF (2/7 Pages) Ironwood Electronics. – Hinged clamshell socket lid

*Note: BGA pattern is not symmetrical with respect
to the mounting holes. The pattern is shifted to the
top of center by 0.25mm.
10.40
2.4125*
Orientation mark
HINGE
30.225±0.125
Socket lid size
2.9125
28.225±0.125
Socket base size
9.725±0.050
12.225±0.125
No component area
DOT SHADED AREA DENOTE CUTOUT
AREAS IN THE SOCKET BASE, 1.5MM HIGH
5.08
1.9125*
0.85±0.05 (x2)
Non plated alignment hole
3.90
2.54
LATCH
14.725±0.05
Target PCB Recommendations
Total thickness: 2.4mm min.
Plating: Gold or Solder finish
16.425±0.125
No component area
25.475±0.125
Socket base/lid size
Description: Recommened PCB Layout
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
CG-BGA-5023 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 39.37
STATUS: Released
ENG: S. Huang
FILE: CG-BGA-5023 Dwg
1.71±0.10 (x4)
Non plated mounting hole
Max Ht: 13.68mm
Max Ht: 3.68mm
Max Ht: 2.18mm
SHEET: 2 OF 7
DRAWN BY: M. Raske
DATE: 02/24/2015
REV. A
SCALE: 3.75:1