CBT-BGA-6049 Datasheet, PDF (2/4 Pages) Ironwood Electronics. – Automated probe manufacturing enables low cost and short lead time

2.3625
0.700
38.225±0.125 ^A
3.7375*
40.000
Socket Base
B
1.9875*
Note: BGA pattern is not symmetrical
with respect to the mounting holes. It is
shifted 0.375mm to the right of center.
0.375 _{Note: Full BGA pattern shown.}
Please adjust pattern according
to individual requirements.
2.540
0.850±0.050
0.025 A B
Non-Plated Alignment Hole
39.625
Socket
Base
1.000 typ.
5.080
2.500
2.500
17.8625 (x8)
Target PCB Recommendations
Total thickness: 1.6mm min.
Plating: Gold or Solder finish
PCB Pad height: same or higher than solder mask
38.600±0.125
40.725
Backing Plate
Description: Recommended PCB layout
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
CBT-BGA-6049 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material:
Finish:
Weight: 188.88
STATUS: Released
ENG: S. Huang
FILE: CBT-BGA-6049 Dwg
0.510 pads (x1020)
1.710±0.100
0.035 A B
Non-Plated Mounting Hole
SHEET: 2 OF 4
DRAWN BY: M. Raske
DATE: 8/4/2015
Bottom pin guide outline
REV. A
SCALE: 3:1