XG-QFN-9000 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

26.225mm
A
Top View
26.225mm
1
Assembled
8.25mm +
IC thickness
6
0.025 A
Side View
(Section AA)
10
11
Customer's
IC
XG-QFN-9000 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Suite 400 Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
GHz MLF Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
IC guide prevents over compression of elastomer
Easily removable swivel socket lid
A
4
3
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Recommended torque =2.125 in lbs./
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
34.0 in oz.
5 ^{High temp. Interposer: Thickness= 0.363mm.}
9
Elastomer Guide: Cirlex
6 _{Thickness = 0.725mm.}
2
8
7
7 ^{IC (MLF) Guide: Ultem1000}
8
Socket base screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 9.525mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10 ^{Insulation Plate: FR4/G10, 1.59mm thick.}
5 ^{Customer's Target PCB}
Backing Plate: Anodized Aluminum 6.35mm thick.
11
Status: Released
Drawing: A. Evans
File: XG-QFN-9000 Dwg
Scale: -
Rev: C
Date: 6/18/08
Modified: 7/8/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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