XG-LGA-7003 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

GHz LGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable swivel socket lid
A
Top View
Assembled
8.25mm +
IC thickness
Side View
(Section AA) ₈
1
4
3
Customer's IC
9
5
A
Recommended torque = 0.5 in lbs./
8 in oz.
7
6
2
10
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Compression screw: Clear anodized
Aluminum.Thickness = 5mm, Hex socket = 5mm.
Interposer: Copper plated kapton and conductive
5 _{elastomer, Thickness = 0.363mm.}
Socket base screw: Socket head cap, alloy steel with
6 _{black oxide finish, 0-80 fine thread , 9.525mm long.}
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
7 _thread.
8 Insulation Plate: FR4/G10, Thickness = 1.59mm.
Backing Plate: Black anodized Aluminum.
9 _{Thickness = 6.35mm.}
10 IC Guide: FR4
Customer's Target PCB
XG-LGA-7003 Drawing
© 2008 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev: B
Drawing: E Smolentseva
Date: 11/12/08
File: XG-LGA-7003 Dwg
Modified: 6/4/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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