XG-BGA-5003 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

40 GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable swivel socket lid
A
Top View
1
Assembled
8.25mm +
IC thickness
11
4
3
A
Recommended torque = 2-3 in lbs.
8
2
7
6
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
Compression Plate: Black anodized Aluminum.
3 _{Thickness = 2.5mm.}
Compression screw: Clear anodized Aluminum.
4 _{Thickness = 5mm, Hex socket = 5mm.}
5
Interposer: Copper plated kapton and conductive
elastomer; Thickness = 0.363mm.
6 ^{IC guide: Ultem}
Socket base screw: Socket head cap, alloy steel with
7 _{black oxide finish, 0-80 fine thread , 9.525mm long.}
Socket lid screw: Socket head cap, alloy steel with
8 _{black oxide finish, 0-80 fine thread , 4.76mm long.}
9 ^{Backing Plate: Aluminum. Thickness = 6.35mm}
10 ^{Insulating Plate: FR4. Thickness = 1.58mm.}
11 ^{Ball Guide: Kapton. Thickness = 0.003".}
Side View
(Section AA)
9
Customer's
BGA IC
XG-BGA-5003 Drawing
© 2008 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
10
5
Customer's Target PCB
Status: Released
Scale: -
Rev: A
Drawing: E Smolentseva
Date: 12/3/08
File: XG-BGA-5003 Dwg.mcd
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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