XG-BGA-5000 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

40 GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable swivel socket lid
A
Top View
1
Assembled
8.25mm +
IC thickness
11
Side View
(Section AA)
9
4
3
5
Customer's
BGA IC
A
Recommended torque = 2-3 in lbs.
8
2
7
6
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
Compression Plate: Black anodized Aluminum.
3 _{Thickness = 2.5mm.}
Compression screw: Clear anodized Aluminum.
4 _{Thickness = 5mm, Hex socket = 5mm.}
5
Interposer: Copper plated kapton and conductive
elastomer; Thickness = 0.363mm.
6 ^{IC guide: Ultem 2300.}
Socket base screw: Socket head cap, alloy steel with
7 _{black oxide finish, 0-80 fine thread , 9.525mm long.}
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
8 _thread.
9 ^{Backing Plate: Aluminum. Thickness = 6.35mm}
10 ^{Insulating Plate: FR4. Thickness = 1.58mm.}
11 ^{Ball Guide: Kapton. Thickness = 0.003".}
10
Customer's Target PCB
XG-BGA-5000 Drawing
© 2008 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: J. Glab
File: XG-BGA-5000 Dwg.mcd
Scale: -
Rev: B
Date: 02/14/08
Modified: 6/4/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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