XG-BGA-4014 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

47.00
40.00
SILVER PARTICLE, SOLDERLESS SOCKET
Features
47.00
• Directly mounts to target PCB (needs tooling holes) with
40.00
hardware.
• High speed, reliable connection
• Minimum real estate required
• Compression plate distributes forces evenly
• Heatsink
Recommended torque: 12 in-oz per screw
47.00
Push Pins not used
while Heatsink is
attached to socket.
27.842
10.242
Heatsink attached to BGA Socket mounted to PCB
2.159
0.770
Heatsink attached to BGA, soldered to PCB
Description: XG socket for 17mm sq., 20x20 array, 0.8mm pitch 400 ball BGA with a heatsink
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
XG-BGA-4014 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 48.01
STATUS: Released
ENG: S. Faiz
FILE: XG-BGA-4014 Dwg
SHEET: 1 OF 4
DRAWN BY: M. Raske
DATE: 8/6/2014
REV. A
SCALE: 1:1