XG-BGA-4004 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
36.225mm
Ø 19mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Side View
(Section AA)
1
Assembled
8.25mm +
IC thickness
36.225mm
4
3
Customer's
5
BGA IC
11
Socket Lid: Black anodized Aluminum.
A
1 Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 6.5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Recommended torque = 18 in lbs.
9
7
Compression screw: Clear anodized Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
5
Interposer: Copper plated kapton and conductive
elastomer; Thickness = 0.312mm.
6 ^{Ball Guide: Kapton polyimide.}
2
8
6
7 ^{Hex Torque wrench adapter: anodized Aluminum.}
8
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 12.7mm long.
Socket lid screw: Shoulder Screw, 18-8 SS, 0-80 fine
9 _thread.
10 ^{Insulation Plate: FR4/G10, Thickness = 2.5mm.}
10
Customer's Target PCB
11
Backing Plate: Black anodized Aluminum.
Thickness = 4.35mm.
XG-BGA-4004 Drawing
© 2010 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: Vinayak R
File: XG-BGA-4004 Dwg.mcd
Scale: -
Rev: A
Date: 2/18/10
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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