XG-BGA-4000 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
32.225mm
A
Side View
(Section AA)
1
Assembled
8.25mm +
IC thickness
6
10
32.225mm
4
3
5
Cust om er's
BGA IC
XG BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Recommended torque = 22.8 in lbs./
365 in oz.
9
2
8
7
11
Customer's Target PCB
Socket Li d: Bla ck a nodized Alu mi num.
1 _{Thickn ess = 2.5mm.}
Socket ba se : Black a nodized Alumin um.
2 _{Thickn ess = 5mm.}
Compression Plate: B lack ano dize d A luminum.
3 _{Thickn ess = 2.5mm.}
Compression screw: Clear an odized Aluminu m.
4 _{Thickn ess = 5mm, Hex socke t = 5mm.}
Ela stomer: Con ductive co pper pla ted kapton
5 _{0.312 mm th ick.}
6
IC guid e G uide: Ultem
Thickn ess = 0.635mm.
7 ^{Bal l Gu ide: K apton polyimide.}
Socket ba se screw: Fil lister hea d, Allo y steel with
8 bla ck o xid e finish, 0-80 fine th read , 12 .7mm long.
Socket lid screw: Shou lder screw, 1 8-8 SS, 0 -80 fine
9 _{thread .}
10 ^{Insulation Plate: FR4 /G1 0, 1.59mm th ick.}
11 ^{Backing Plate: A nodized Alu min um 6 .35 mm thick.}
XG-BGA-4000 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev: B
Drawing: E Smolentseva
File: XG -BGA -4000 Dwg
Date: 4/22/09
Modified: 5/19/09
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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