SMP-QFN-8015 Datasheet, PDF (1/6 Pages) Ironwood Electronics. – Automated probe manufacturing enables low cost and short lead time

SMP QFN DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN
AND TEST APPLICATIONS
34 backing plate
32±0.125 socket body
7
A
A
Features
• Wide temperature range (-55C to +180C).
• High current capability (up to 8A).
• Excellent signal integrity at high frequencies.
• Low and stable contact resistance for reliable production yield.
• Highly compliant to accommodate wide co-planarity variations.
• Automated probe manufacturing enables low cost and short lead time.
28
socket
lid
3.8000
4.4250
Recommended torque is 5.65 Ncm (0.5 lbf in)
90°
6.9323
2.500
2.5000
6
SECTION A-A
customer's device
Description: SMP socket for 8x8mm 0.5mm pitch QFN56
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SMP-QFN-8015 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 33.42
customer's target PCB
STATUS: Released
ENG: E. Smolentseva
FILE: SMP-QFN-8015.Dwg
SHEET: 1 OF 6
DRAWN BY: M. Raske
DATE: 5/3/2016
REV. A
SCALE: 1.7:1