SMP-QFN-8009 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

A
17.73
13.63
SMP-QFN Socket - Direct mount, solderless
Features
• Directly mounts to target PCB (needs tooling holes) with hardware
• Minimum real estate required
• Compression plate distributes forces evenly
• Easily removable swivel socket lid
A
P-LAYER
RECOMMENDED
TORQUE: 11.3 N-cm [1 IN-LB]
Remove torque when device
is not under test
SM-LAYER
8.85
1.59
7.59
SECTION A-A
Description: SMP-QFN64 5x10mm 22x10 0.4
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SMP-QFN-8009 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 10.98
STATUS: Released
ENG: B. Schatz
FILE: SMP-QFN-8009 Dwg
SHEET: 1 OF 4
DRAWN BY: M. Raske
DATE: 09/18/2015
REV. A
SCALE: 4:1