SMP-CGA-3000 Datasheet, PDF (1/9 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

28.225
17.900
38.500
57.500
28.225
A
SMP-CGA DIRECT MOUNT, SOLDERLESS SOCKET FOR
BURN-IN AND TEST APPLICATIONS
xGA IC
FEATURES:
Wide temperature range (-55C to +155C )
High current capability (up to 4A )
Excellent signal integrity at high frequencies
Low and stable contact resistance for reliable production yield
IC guide
SMP protective layer
SMP SM interposer layer
double latch lid
W/ compression plate
target board
DETAIL B
SCALE 8 : 1
Recommended torque = 5 in-lbs
/ 56.5 N-cm
IC
Removable IC guide
24.950
A
15.000
2.670
B
SECTION A-A
Description: Double latch snap lid SMP xGA255 21x21mm IC 16x16 array 1.27mm pitch
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SMP-CGA-3000 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 93.41
STATUS: Released
ENG: S. Huang
FILE: SMP-CGA-3000 Dwg
SHEET: 1 OF 9
DRAWN BY: M. Raske
DATE: 06/10/2015
REV. A
SCALE: 1.15:1