SM-BGA-9039 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

31
BACKING PLATE
A
Silver Ball Matrix BGA Socket - Direct mount, solderless
29
SOCKET BASE
A
Features
• Directly mounts to target PCB (needs tooling holes) with hardware
• High speed, reliable Elastomer connection
• Minimum real estate required
• Compression plate distributes forces evenly
• Ball guide prevents over compression of elastomer
• Easily removable swivel socket lid
Recommended torque: 15 in.lbs.
11.3
5.6
3.500
SECTION A-A
Description: SM-BGA602 swivel lid 23x23mm 0.8mm 28x28 array
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SM-BGA-9039 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 27.81
STATUS: Released
ENG: B. Schatz
FILE: SM-BGA-9039 Dwg
SHEET: 1 OF 4
DRAWN BY: M. Raske
DATE: 9-23-2013
REV. B
SCALE: 2:1