SM-BGA-9027 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Low and stable contact resistance for reliable production yield

SM-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND
TEST APPLICATIONS
Features
• Wide temperature range (-55C to +180C).
• High current capability (up to 4A).
• Over 40GHz bandwidth @ -1dB for edge pins
• Low and stable contact resistance for reliable production yield.
• Self inductance under 0.21nH
• Highly compliant to accommodate wide co-planarity variations.
TOP VIEW
45.14
3.016
37.241
1.516
4.80
1.516
FRONT VIEW
25.475
SIDE VIEW
30.225
15.225
64.925
Description: SM BGA 144 7x7mm IC 0.5mm Pitch
SIDE VIEW (Clam shell lid open)
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SM-BGA-9027 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 52.07
STATUS: Released
DRAWN BY: B. Fedde
FILE: SM-BGA-9027 Dwg
SHEET: 1 OF 5
SCALE: 1.5:1
DATE: 5/15/2013
REV. B