SG25-BGA-2019 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

14.73
GHz BGA Socket - Direct mount, solderless
Features
• Directly mounts to target PCB (needs tooling holes) with hardware
• High speed, reliable Elastomer connection
• Minimum real estate required
• Compression plate distributes forces evenly
• Ball guide prevents over compression of elastomer
• Easily removable swivel socket lid
10.63
Cross-section of BGA
compressed on elastomer
RECOMMENDED TORQUE: 5.7 Ncm (0.5 lbf in)
8.02
1.59
7.588
Description: Socket for 3.868x3.068mm 9X7 0.4mm pitch BGA63
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SG25-BGA-2019 Drawing
©2015 Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 7.67
STATUS: Released
ENG: E. Smolentseva
FILE: SG25-BGA-2019 Dwg
SHEET: 1 OF 4
DRAWN BY: M. Raske
DATE: 05/03/2016
REV. A
SCALE: 4:1