SG-SOIC-3000 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
14.925mm
GHz MLF Socket - Epoxy mount, solderless
Features
Directly mounts to target PCB (needs epoxy) .
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
A
Side View
(Section AA)
1
Assembled
8.0mm +
IC thickness
11.525mm
Customer's
SOIC
7.8mm
SG-SOIC-3000 Drawing
© 2008 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
A
Recommended torque:
6-8 in-ozs
4
6
2
3
Epoxy
7
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
Compression Plate: Ultem.
3 _{Thickness = 3.5mm.}
Compression screw: Clear anodized Aluminum.
4 _{Thickness = 5mm, Hex socket = 2mm.}
Elastomer: 20 micron dia gold plated brass
filaments arranged symmetrically in a silicone
5 _{rubber (63.5 degree angle).}
Thickness = 0.5mm.
6
Socket lid screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 4.76mm long.
7 Lead guide: Kapton.
Note: Alignment guide for positioning
socket base to target PCB will be supplied.
5
Customer's Target PCB
Status: Released
Drawing: J. Glab
File: SG-SOIC-3000 Dwg
Scale: -
Rev: A
Date: 01/25/08
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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