SG-BGA-8032 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Easily removable swivel socket lid

GHz BGA Socket - Direct mount, solderless
55.000 heatsink
A
A
Features
• Directly mounts to target PCB (needs tooling holes) with hardware
• High speed, reliable Elastomer connection
• Minimum real estate required
• Compression plate distributes forces evenly
• Ball guide prevents over compression of elastomer
• Easily removable swivel socket lid
TOP VIEW
Instructions:
1. If attached, remove fan from heat sink assembly
2. Apply 2 in lb torque to the compression screw,
3. Attach fan to heat sink / compression screw assembly.
35.172
10.00
44.700
1.588
10.00
12.3
6.35
SECTION A-A
26.225
28.730
Description: GHz socket for 13x20mm, 15x23 array 0.8mm pitch
Primary dimension units are millimeters, Secondary dimension units are [inches].
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SG-BGA-8032 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 105.92
STATUS: Released
DRAWN BY: V. Panavala
FILE: SG-BGA-8032 Dwg
SHEET: 1 OF 4
SCALE: 1.2:1
DATE: 01/3/2012
REV. A