SG-BGA-7267 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

A
TOP VIEW
15.225
GHz BGA Socket - Epoxy mount, solderless
Features
• Directly mounts to target PCB using epoxy.
• High speed, reliable Elastomer connection
• Minimum real estate required
• Compression plate distributes forces evenly
• Ball guide prevents over compression of elastomer
A
• Easily removable swivel socket lid
15.225
Socket base with a notch
located on the opposite side
of pin A1 location.
DETAIL D
SCALE 16 : 1
Recommended torque: 0.75 in-lb - 1.5 in-lb
9.33
2.22
D
SECTION A-A
Epoxy Fillet
Description: SG epoxy socket for 222 pin BGA, 8.80x9.25mm, mixed pitch
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SG-BGA-7267 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 4.45
STATUS: Released
ENG: S. Faiz
FILE: SG-BGA-7267 Dwg
SHEET: 1 OF 5
DRAWN BY: M. Raske
DATE: 12-12-2013
REV. B
SCALE: 3:1