SG-BGA-7261 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

A
Top View
1
Assembled
8.25mm +
IC thickness
6
Side View
(Section AA)
10
Customer's
11
BGA IC
SG-BGA-7261 Drawing
© 2012 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
4
3
A
Recommended torque = 0.6 in lbs.
9
2
8
12
7
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 20 micron dia gold plated brass
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.5mm.
6
Elastomer Guide: Non-clad FR4.
Thickness = 0.475mm.
7 Ball Guide: Kapton polyimide.
Socket base screw: Socket head cap, alloy steel with
8 _{black oxide finish, 0-80 fine thread , 9.525mm long.}
Socket lid screw: Socket head cap, alloy steel with
9 _{black oxide finish, 0-80 fine thread , 4.76mm long.}
10 ^{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
5
Customer's Target PCB
Backing Plate: Black anodized 6061 Aluminum.
11 _{Thickness = 6.35mm.}
12 ^{IC Guide: Torlon}
Status: Released
Drawing: S. Huang
File: SG-BGA-7261 Dwg.mcd
Scale: -
Rev: B
Date: 8-6-13
Modified: 04/10/14, DH
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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