SG-BGA-7249 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

18.6750
F
GHz BGA Socket - Epoxy mount, solderless
Features
• Directly mounts to target PCB (needs epoxy)
• High speed, reliable Elastomer connection
• Minimum real estate required
• Compression plate distributes forces evenly
• Easily removable socket lid
F
Recommeded torque = 3--6 in-oz
3
2
9.3292
1
2.5000
11.5000
4
5
8
9
Epoxy
ITEM
NO.
1
DESCRIPTION
Epoxy socket base for 5 x 13.5mm IC
Material
7075-T6 Aluminum Alloy
2
Epoxy Socket Lid for 5x13.5mm IC
7075-T6 Aluminum Alloy
3
#0-80 Shoulder Screw, 0.062" thread length
Stainless Steel (303)
4
M4 5mm long 0.7mm pitch screw
Black-Oxide Alloy Steel
5
Compression plate for 5x13.5mm IC
6
Ball guide for 5 x 13.5mm 7x20 array 0.65mmpitch
IC
7 Target PCB 5x13.5mm 0.65mm pitch 7x20 array
7075-T6 Aluminum Alloy
Kapton Polyimide/Cirlex
Material <not specified>
8 BGA140 CHIP 0.65mm pitch 7x20 array 5x13.5mm
High Temp FR4
20 Micron dia gold plated
9
0.5mm thick, 0.05x 0.05mm pitch, 50mm sqr, Z-axis
conductive angled elastomer
brass filaments arranged
symettrically in a silicon rubber
(63.5 degree angle),
Thickness: 0.5mm
6
6.5250
7
7.9250
SECTION F-F
Note: Alignment guide for positioning socket base to target PCB will be supplied.
Description: GHz BGA Socket - Epoxy mount 5x13.5mm IC 0.65mm pitch 7x20 array
Primary dimension units are millimeters, Secondary dimension units are [inches].
SG-BGA-7249 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
WEIGHT: 1.05
MATERIAL: N/A
FINISH: N/A
STATUS: Released
DRAWN BY: S. Huang
File: SG-BGA-7249
SHEET: 1 OF 4
SCALE: 4:1
DATE: 11/14/12
REV. A