SG-BGA-7231 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
17.125mm
GHz BGA Socket - Epoxy mount, solderless
Features
Directly mounts to target PCB (needs epoxy) .
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable socket lid
A
1
Assembled
8.0mm +
IC thickness
A
17.125mm
Recommended torque 2.0 in lb.
4
6
3
2
Epoxy
Socket Li d: Bla ck a nodized 60 61 Aluminum.
1 Thickn ess = 2.5mm.
2
Socket ba se : Black a nodized 606 1 A luminum.
Thickn ess = 5mm.
3
Compression Plate: B lack ano dize d 6 061 Alu min um.
Thickn ess = 2.5mm.
Compression screw: Clear an odized 6061 A luminum.
4 Thickn ess = 5mm, Hex socke t = 5mm.
Ela stomer: 2 0 micron dia go ld plated brass
5 filaments ar ranged symmetrically in a silicone
rub ber (63.5 degre e a ngle).
Thickn ess = 0.5mm.
Socket lid screw: Socket hea d cap , Alloy steel with
6 _{bla ck o xid e finish, 0-80 fine th read , 4.76mm long.}
Side View
(Section AA)
Cust om er's
BGA IC
14.63mm
SG-BGA-7231 Drawing
© 2012 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Note: Alignment guide for positioning socket
base to target PCB will be supplied.
5
Customer's Target PCB
Status: Released
Drawing: M.A. Fedde
File: SG-B GA-7 231 Dwg
Scale: -
Rev: B
Date: 4/23/12
Modified: 08/01/14
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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