SG-BGA-7185 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
30.225mm
A
Side View
(Section AA)
1
Assembled
8.25mm +
IC thickness
30.225mm
6
10
Customer's
BGA IC
SG-BGA-7185 Drawing
© 2010 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
Socket base: Black anodized Aluminum.
2 _{Thickness = 6.5mm.}
Compression Plate: Black anodized Aluminum.
3 _{Thickness = 2.5mm.}
4
3
5
Recommended torque = 6 in lbs.
9
2
8
7
11
Customer's Target PCB
Compression screw: Clear anodized Aluminum.
4 _{Thickness = 5mm, Hex socket = 5mm.}
Elastomer: 40 micron dia gold plated brass
5 _{filaments arranged symmetrically in a silicone}
rubber (63.5 degree angle).
Thickness = 0.5mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.475mm.}
7 _{Ball Guide: Kapton polyimide.}
Socket base screw: Socket head cap, Alloy steel with
8 _{black oxide finish, 0-80 fine thread , 15.875mm long.}
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 _thread.
10 ^{Backing Plate: Anodized Aluminum 6.35mm thick.}
11 ^{Insulation Plate: FR4/G10, 1.59mm thick.}
Status: Released
Scale: -
Rev: A
Drawing: E Smolentseva
Date: 4/5/10
File: SG-BGA-7185 Dwg
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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