SG-BGA-7184 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

15.225mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable swivel socket lid
A
Top View
15.225mm
1
Assembled
8.25mm +
IC thickness
6
4
3
Side View
(Section AA) ₁₀
12
Customer's
11
BGA IC
5
A
Recommended torque = 1 in lbs./
16 in oz.
9
2
8
7
Customer's Target PCB
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 20 micron dia gold plated brass
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.5mm.
6
Elastomer Guide: Non-clad FR4.
Thickness = 0.475mm.
7 Ball Guide: Kapton polyimide.
Socket base screw: Socket head cap, alloy steel with
8 _{black oxide finish, 0-80 fine thread , 12.7mm long.}
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 _thread.
10 ^{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
Backing Plate: Black anodized Aluminum.
11 _{Thickness = 6.35mm.}
12 IC Guide: 0.5mm thick.
SG-BGA-7184 Drawing
© 2010 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Suite 400 Burnsville MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: S.Natarajan
File: SG-BGA-7184 Dwg.mcd
Scale: -
Rev: A
Date: 06/08/2010
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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