SG-BGA-7170 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

15.225 mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable swivel socket lid
A
Top View
1
4.0 mm
square
15.225 mm
Assembled
7.8mm +
IC thickness
10
Side View
(Section AA)
8
4
3
Customer's
BGA IC
A
Recommended torque = 2 to 6 in oz.
(x 4 screws)
[Hand tighten &
turn 1/4 turn more with the L key]
7
2
6
5
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 1.75mmtop, 7.45mm total}
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
Elastomer: 20 micron dia gold plated brass
filaments arranged symmetrically in a silicone
3 _{rubber (63.5 degree angle).}
Thickness = 0.5mm.
Elastomer Guide: Non-clad FR4.
4 _{Thickness = 0.475mm.}
5 IC guide: Torlon.
6
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 12.7mm long.
Socket lid screw: Socket head cap, alloy steel with
7 _{black oxide finish, 0-80 fine thread , 4.76mm long.}
Backing Plate: Black anodized Aluminum. Thickness =
8 _6.35mm
9 Insulating Plate: FR4. Thickness = 1.58mm.
10 ^{Ball Guide: Kapton polymide.}
9
Customer's Target PCB
SG-BGA-7170 Drawing
© 2010 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: S.Natarajan
File: SG-BGA-7170 Dwg.mcd
Scale: -
Rev: B
Date: 04/02/2010
Modified: 09/18/14, DH
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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