SG-BGA-7157 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
17.125mm
A
1
Assembled
8.0mm +
IC thickness
17.125mm
GHz BGA Socket - Epoxy mount, solderless
Features
Directly mounts to target PCB (needs epoxy) .
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable socket lid
A
Recommended torque 6 in-oz.
4
6
3
Socket Lid: Black anodized 6061 Aluminum.
1 Thickness = 2.5mm.
2
Socket base: Black anodized 6061 Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized 6061 Aluminum.
Thickness = 2.5mm.
Compression screw: Clear anodized 6061 Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Elastomer: straight elastomer, 0.5mm thick, wires
5 _{on 0.05x0.05mm centers}
6 ^{Socket lid screw: Socket head cap, alloy steel with}
black oxide finish, 0-80 fine thread.
2
Epoxy
Side View
(Section AA)
Customer's
BGA IC
5
13.38mm
Customer's Target PCB
SG-BGA-7157 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr., Suite 400, Burnsville MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev: B
Drawing: E Smolentseva
Date: 10/19/09
File: SG-BGA-7157 Dwg
Modified: 08/01/14
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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