SG-BGA-7141 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
12.125mm
GHz BGA Socket - Epoxy mount, solderless
Features
Directly mounts to target PCB (needs epoxy) .
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable socket lid
A
Side View
(Section AA)
1
Assembled
8.0mm +
IC thickness
A
12.125mm
Recommended torque 1 in lb.
4
6
3
2
Epoxy
Socket Li d: Bla ck a nodized Alu mi num.
1 _{Thickn ess = 2.5mm.}
Socket ba se : Black a nodized Alumin um.
2 _{Thickn ess = 5mm.}
Compression Plate: B lack ano dize d A luminum.
3 _{Thickn ess = 2.5mm.}
Compression screw: Clear an odized Aluminu m.
4 _{Thickn ess = 5mm, Hex socke t = 5mm.}
Ela stomer: 2 0 micron dia go ld plated brass
5
filaments ar ranged symmetrically in a silicone
rub ber (63.5 degre e a ngle).
Thickn ess = 0.5mm.
Socket lid screw: Socket hea d cap , Alloy steel with
6 _{bla ck o xid e finish, 0-80 fine th read , 4.76mm long.}
Cust om er's
BGA IC
7.68mm
SG-BGA-7141 Drawing
© 2008 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr. Ste 400 Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Note: Alignment guide for positioning socket
base to target PCB will be supplied.
5
Customer's Target PCB
Status: Released
Scale: -
Rev: B
Drawing: E Smolentseva
Date: 08/06/08
File: S G-BGA -7141 Dwg
Modified: 07/31/14
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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