SG-BGA-7136 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable swivel socket lid
A
Top View
1
Assembled
8.25mm +
IC thickness
12
6
Side View
(Section AA) ₁₀
Customer's
11
BGA IC
SG-BGA-7136 Drawing
© 2010 IRONWOOD ELECTRONICS, INC.
Tele: 1 [phone]
www.ironwoodelectronics.com
4
3
5
A
Recommended torque = 0.8 in lbs./
12.8 in oz.
9
2
8
7
Customer's Target PCB
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 20 micron dia gold plated brass
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.5mm.
6
Elastomer Guide: Non-clad FR4.
Thickness = 0.475mm.
7 Ball Guide: Kapton polyimide.
Socket base screw: Socket head cap, alloy steel with
8 _{black oxide finish, 0-80 fine thread , 9.525mm long.}
9
Socket lid Shoulder screw: Socket head cap, alloy
steel 0-80 fine thread.
10 ^{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
Backing Plate: Black anodized Aluminum.
11 _{Thickness = 6.35mm.}
12 IC Guide: Ultem 1000.
Status: Released
Drawing: Vinayak R
File: SG-BGA-7136 Dwg
Scale: -
Rev: A
Date: 2/19/10
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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