SG-BGA-7125 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
15.13mm
18.13mm
GHz BGA Socket - Epoxy mount, solderless
Features
Directly mounts to target PCB (needs epoxy) .
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable socket lid
A
Side View
(Section AA)
4
8mm + IC thickness
assembled
3
A
Recommended torque 8-16 in oz.
6
1
2
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Compression screw: Clear anodized Aluminum.
4 Thickness = 5mm, Hex socket = 3mm.
Elastomer: 20 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.5mm.
6
Socket lid screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 4.76mm long.
Epoxy
0.25mm
5
Customer's BGA IC
9.95mm
Customer's Target PCB
Note: Alignment guide for positioning socket
base to target PCB will be supplied.
SG-BGA-7125 Drawing
© 2008 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: A. Evans
File: SG-BGA-7125 Dwg
Scale: -
Rev: B
Date: 06/16/08
Modified: 07/31/14
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 OF 4