SG-BGA-7122 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
15.225 mm
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable swivel socket lid
A
A
1
Assembled
7.8mm +
IC thickness
10
6.0 mm
15.225 mm
Recommended torque = 0.5 in lbs.
7
2
6
5
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 1.75mmtop, 7.45mm total}
Socket base: Black anodized Aluminum.
2 _{Thickness = 5mm.}
Elastomer: 20 micron dia gold plated brass
filaments arranged symmetrically in a silicone
3 _{rubber (63.5 degree angle).}
Thickness = 0.5mm.
Elastomer Guide: Non-clad FR4.
4 _{Thickness = 0.475mm.}
5 IC guide: Torlon
6
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 12.7mm long.
Socket lid screw: Socket head cap, alloy steel with
7 _{black oxide finish, 0-80 fine thread , 4.76mm long.}
Backing Plate: Black anodized Aluminum. Thickness =
8 _6.35mm
9 Insulating Plate: FR4. Thickness = 1.58mm.
10 ^{Ball Guide: Kapton polymide.}
Side View
(Section AA)
8
4
3
Customer's
BGA IC
9
Customer's Target PCB
SG-BGA-7122 Drawing
© 2008 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: J. Glab
File: SG-BGA-7122 Dwg.mcd
Scale: -
Rev: C
Date: 01/29/08
Modified: 09/18/14, DH
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 4
Recommended PCB Layout