SG-BGA-7120 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

A
Top View
Assembled
8.25mm +
IC thickness
6
Side View
(Section AA) ₁₀
1
4
3
Customer's
11
BGA IC
5
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable swivel socket lid
A
Recommended torque = 0.5 in lbs./
8 in oz.
9
2
8
12 ₇
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
Compression Plate: Black anodized Aluminum.
3 _{Thickness = 2.5mm.}
Compression screw: Clear anodized Aluminum.
4 _{Thickness = 5mm, Hex socket = 5mm.}
Elastomer: 20 micron dia gold plated brass
filaments arranged symmetrically in a silicone
5 _{rubber (63.5 degree angle).}
Thickness = 0.5mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.475mm.}
7 Ball Guide: Kapton polyimide.
Socket base screw: Socket head cap, alloy steel with
8 _{black oxide finish, 0-80 fine thread , 9.525mm long.}
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 _thread.
10 ^{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
Backing Plate: Black anodized Aluminum.
11 _{Thickness = 6.35mm.}
12 IC Guide: Ultem
Customer's Target PCB
SG-BGA-7120 Drawing
© 2008 IRONWOOD ELECTRONICS, INC.
11351 Rupp Dr., Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: J. Glab
File: SG-BGA-7120 Dwg
Scale: -
Rev: B
Date: 01/18/08
Modified: 6/4/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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