SG-BGA-7090 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
19.125mm
A
1
Assembled
8.0mm +
IC thickness
19.125mm
GHz BGA Socket - Epoxy mount, solderless
Features
Directly mounts to target PCB (needs epoxy) .
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable socket lid
A
Recommended torque 4 - 7 in lb.
4
6
3
2
Epoxy
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
Compression Plate: Black anodized Aluminum.
3 _{Thickness = 2.5mm.}
Compression screw: Clear anodized Aluminum.
4 _{Thickness = 5mm, Hex socket = 5mm.}
Interposer: Copper plated kapton and conductive
5 _{elastomer; Thickness = 0.363mm.}
Socket lid screw: Socket head cap, Alloy steel with
6 _{black oxide finish, 0-80 fine thread , 4.76mm long.}
Side View
(Section AA)
Customer's
BGA IC
5
15.2mm
Customer's Target PCB
SG-BGA-7090 Drawing
© 2007 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Drawing: J. Glab
File: SG-BGA-7090 Dwg
Scale: -
Rev: C
Date: 04/30/07
Modified: 07/31/14
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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