SG-BGA-7085 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable swivel socket lid
A
Top View
1
Assembled
8.25mm +
IC thickness
12
Side View
(Section AA)
10
6
Customer's
BGA IC
SG-BGA-7085 Drawing
© 2006 IRONWOOD ELECTRONICS, INC.
11351 Rupp Drive, Suite 400, Burnsville, MN 55337
Tele: [phone]
www.ironwoodelectronics.com
4
3
5
A
Recommended torque = 0.6 in lbs.
9
2
8
7
11
Customer's Target PCB
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 20 micron dia gold plated brass
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.5mm.
6
Elastomer Guide: Non-clad FR4.
Thickness = 0.475mm.
7 ^{IC guide: Ultem 1000.}
Socket base screw: Socket head cap, alloy steel with
8 black oxide finish, 0-80 fine thread , 9.525mm long.
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 thread.
Backing Plate: Aluminum. Thickness = 6.35mm
10
11 ^{Insulating Plate: FR4. Thickness = 1.59mm.}
12 ^{Ball Guide: Kapton. Thickness = 0.003".}
Status: Released
Drawing: J. Glab
File: SG-BGA-7085 Dwg.mcd
Scale: -
Rev: B
Date: 1/5/07
Modified: 6/4/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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