SG-BGA-7065 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

20.225mm
A
Top View
1
Assembled
8.25mm +
IC thickness
20.225mm
4
3
12
Side View
(Section AA)
6
10
Customer's
5
BGA IC
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
Recommended torque = 2 in-lb.
9
2
8
7
11
Customer's Target PCB
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Compression screw: Clear anodized Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Elastomer: 20 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.5mm.
Elastomer Guide: Cirlex
6 _{Thickness = 0.475mm.}
7 ^{IC Guide: Ultem 1000}
8
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 15.875mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
Backing Plate: Black anodized Aluminum.
10 Thickness = 6.35mm.
11 ^{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
Ball Guide: Kapton polyimide.
12
SG-BGA-7065 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev: C
Drawing: E Smolentseva
Date: 5/16/05
File: SG-BGA-7065 Dwg.mcd
Modified: 7/2/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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