SG-BGA-7064 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
12.56mm
A
Side View
(Section AA)
Assembled
8.0mm +
IC thickness
16.125mm
1
Cust om er's
BGA IC
SG-BGA-7064 Drawing
© 2005 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Epoxy mount, solderless
Features
Directly mounts to target PCB (needs epoxy) .
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable socket lid
A
Recommended torque = 0.38 in.-lbs
(6 in.-oz.).
4
6
3
2
Epoxy
Socket Li d: Bla ck a nodized 60 61 Aluminum.
1 Thickn ess = 2.5mm.
2
Socket ba se : Black a nodized 606 1 A luminum.
Thickn ess = 5mm.
3
Compression Plate: B lack ano dize d 6 061 Alu min um.
Thickn ess = 2.5mm.
Compression screw: Clear an odized 6061 A luminum.
4 Thickn ess = 5mm, Hex socke t = 5mm.
Ela stomer: 2 0 micron dia go ld plated brass
5 filaments ar ranged symmetrically in a silicone
rub ber (63.5 degre e a ngle).
Thickn ess = 0.5mm.
6
Socket lid screw: Socket hea d cap , Alloy steel with
bla ck o xid e finish, 0-80 fine th read , 4.76mm long.
Note: Alignment guide for positioning socket
base to target PCB will be supplied.
5
Customer's Target PCB
Status: Released
Scale: -
Rev: D
Drawing: H. Hansen
File: S G-BGA -7064 Dwg
Date: 5/24/05
Modified: 07/31/14
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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