SG-BGA-7054 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

A
Top View
1
Assembled
8.25mm +
IC thickness
6
Side View
(Section AA) ₁₀
Customer's
11
BGA IC
SG-BGA-7054 Drawing
© 2005 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Direct mount, solderless
4
3
5
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable swivel socket lid
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
A
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
Recommended torque = 0.5 in lbs./
8 in oz.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 20 micron dia gold plated brass
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.5mm.
6
Elastomer Guide: Non-clad FR4.
Thickness = 0.475mm.
9
2
8
12 ₇
Customer's Target PCB
7 Ball Guide: Kapton polyimide.
Socket base screw: Socket head cap, alloy steel with
8 _{black oxide finish, 0-80 fine thread , 9.525mm long.}
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 _thread.
10 ^{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
Backing Plate: Black anodized Aluminum.
11 _{Thickness = 6.35mm.}
12 ^{IC Guide: Torlon}
Status: Released
Drawing: H. Hansen
File: SG-BGA-7054 Dwg
Scale: -
Rev: C
Date: 5/11/05
Modified: 07/16/14, DH
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 4
Recommended PCB Layout