SG-BGA-7045 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable swivel socket lid
A
Top View
1
Assembled
8.25mm +
IC thickness
Side View
12
(Section AA)
6
10
Cust om er's
BGA IC
SG-BGA-7045 Drawing
© 2005 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
4
3
5
A
Recommended torque = 0.6 in lbs.
9
2
8
7
11
Customer's Target PCB
1
Socket Li d: Bla ck a nodized Alu mi num.
Thickn ess = 2.5mm.
2
Socket ba se : Black a nodized Alumin um.
Thickn ess = 5mm.
3
Compression Plate: B lack ano dize d A luminum.
Thickn ess = 2.5mm.
4
Compression screw: Clear an odized Aluminu m.
Thickn ess = 5mm, Hex socke t = 5mm.
Ela stomer: 2 0 micron dia go ld plated brass
5
filaments ar ranged symmetrically in a silicone
rub ber (63.5 degre e a ngle).
Thickn ess = 0.5mm.
6 ^{Ela stomer Guid e: Non-clad FR4 .}
Thickn ess = 0.475mm.
7 ^{IC guid e: Torlon .}
Socket ba se screw: Socket hea d cap , alloy steel with
8 bla ck o xid e finish, 0-80 fine th read , 9.525 mm long .
Socket lid screw: Shou lder screw, 1 8-8 SS, 0 -80 fine
9 thread .
Backing Plate: A luminum. Thickness = 6.35 mm
10
Insulating Plate: FR4. Thickness = 1.58mm.
11
12 Bal l Gu ide: K apton. Thi ckness = 0.00 3".
Status: Released
Scale: -
Rev: C
Drawing: E Smolentseva
File: S G-BGA -7045 Dwg.mcd
Date: 3/15/05
Modified: 11/14/14, DH
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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