SG-BGA-7038 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable swivel socket lid
A
Top View
1
Assembled
8.25mm +
IC thickness
Side View
(Section AA)
6
10
Customer's
11
BGA IC
SG-BGA-7038 Drawing
© 2005 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
4
3
5
12
A
Recommended torque = 1.0 in. lbs.
9
16 in. oz.
2
8
7
Customer's Target PCB
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 20 micron dia gold plated brass
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.5mm.
6
Elastomer Guide: Non-clad FR4.
Thickness = 0.425mm.
7 IC guide: Ultem 1000.
8
Socket base screw: Socket head cap, alloy steel with
black oxide finish, 0-80 fine thread , 9.525mm long.
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
Insulation Plate: FR4/G10, Thickness = 1.59mm.
10
Backing Plate: Black anodized Aluminum.
11 _{Thickness = 6.35mm.}
12 ^{Ball Guide}
Status: Released
Drawing: H. Hansen
File: SG-BGA-7038 Dwg
Scale: -
Rev: C
Date: 7/12/05
Modified: 6/2/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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