SG-BGA-7028 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

Top View
18.125mm
A
Side View
(Section AA)
1
Assembled
8.0mm +
IC thickness
18.125mm
4
3
GHz BGA Socket - Epoxy mount, solderless
Features
Directly mounts to target PCB (needs epoxy) .
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable socket lid
A
Recommended torque 1.5 in lb.
6
Socket Lid: Black anodized 6061 Aluminum.
1 Thickness = 2.5mm.
2
Socket base: Black anodized 6061 Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized 6061 Aluminum.
Thickness = 2.5mm.
Compression screw: Clear anodized 6061 Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
Elastomer: 20 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.5mm.
6
Socket lid screw: Socket head cap, Alloy steel with
black oxide finish, 0-80 fine thread , 4.76mm long.
2
Epoxy
Customer's
BGA IC
15.63mm
SG-BGA-7028 Drawing
© 2005 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
Note: Alignment guide for positioning socket
base to target PCB will be supplied.
5
Customer's Target PCB
Status: Released
Scale: -
Rev: C
Drawing: H. Hansen
Date: 1/10/05
File: SG-BGA-7028 Dwg
Modified: 07/31/14
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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