SG-BGA-7025 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

A
Top View
Assembled
8.25mm +
IC thickness
6
Side View
(Section AA)
10
1
Customer's
11
BGA IC
SG-BGA-7025 Drawing
© 2004 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
4
3
5
A
Recommended torque = 1in lbs/
16in oz
9
2
8
12
7
Customer's Target PCB
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 20 micron dia gold plated brass
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.5mm.
6
Elastomer Guide: Non-clad FR4.
Thickness = 0.475mm.
7 Ball Guide: Dura-Lar oriented polyester
Socket base screw: Socket head cap, alloy steel with
8 _{black oxide finish, 0-80 fine thread , 9.525mm long.}
9
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
thread.
10 ^{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
Backing Plate: Black anodized Aluminum.
11 _{Thickness = 6.35mm.}
12 ^{IC Guide: Torlon}
Status: Released
Drawing: Heidi Hansen
File: SG-BGA-7025 Dwg.mcd
Scale: -
Rev: E
Date: 1/28/04
Modified: 11/11/14, DH
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 4
*Note: BGA pattern is not symmetrical