SG-BGA-7019 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable swivel socket lid
A
Top View
1
Assembled
8.25mm +
IC thickness
6
Side View
(Section AA) ₁₀
Customer's
11
BGA IC
SG-BGA-7019 Drawing
© 2004 IRONWOOD ELECTRONICS, INC.
PO BOX 21151 ST. PAUL, MN 55121
Tele: [phone]
www.ironwoodelectronics.com
4
3
5
A
Recommended torque = 2 in lbs./
32 in oz.
9
2
8
7
Customer's Target PCB
1
Socket Lid: Black anodized 6061 Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized 6061 Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized 6061 Aluminum.
Thickness = 2.5mm.
4
Compression screw: Clear anodized 6061 Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 20 micron dia gold plated brass
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.5mm.
6
Elastomer Guide: Non-clad FR4.
Thickness = 0.475mm.
7 Ball Guide: Kapton polyimide.
Socket base screw: Socket head cap, alloy steel with
8 _{black oxide finish, 0-80 fine thread , 9.525mm long.}
Socket lid screw: Socket head cap, alloy steel with
9 _{black oxide finish, 0-80 fine thread , 4.76mm long.}
10 ^{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
Backing Plate: Black anodized 6061 Aluminum.
11 _{Thickness = 6.35mm.}
Status: Released
Drawing: H. Hansen
File: SG-BGA-7019 Dwg
Scale: -
Rev: B
Date: 1/28/04
Modified: 5/24/05
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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