SG-BGA-7012 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable swivel socket lid
A
Top View
Assembled
8.71mm +
IC thickness
6
Side View ₁₀
(Section AA)
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
A
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Recommended torque = 0.38 in lbs.
Elastomer: 20 micron dia gold plated brass
(6 in oz.)
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
1
4
Thickness = 0.5mm.
3
9
6
Elastomer Guide: Non-clad FR4.
Thickness = 0.475mm.
2
8
12
7
7 Ball Guide: Kapton polyimide.
Socket base screw: Socket head cap, alloy steel with
8 _{black oxide finish, 0-80 fine thread , 12.7mm long.}
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 _thread.
11
Customer's
5
BGA IC
Customer's Target PCB
10 ^{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
Backing Plate: Black anodized Aluminum.
11 _{Thickness = 6.35mm.}
12 IC Guide: FR4/G10
SG-BGA-7012 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev: E
Drawing: E Smolentseva
Date: 2/12/03
File: SG-BGA-7012 Dwg
Modified: 6/26/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
PAGE 1 of 4