SG-BGA-7003 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

A
Top View
Assembled
8.25mm +
IC thickness
6
Side View
(Section AA) ₁₀
1
4
3
Customer's
11
BGA IC
5
GHz BGA Socket - Direct mount, solderless
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable swivel socket lid
A
Recommended torque = 0.38 in lbs.
(6 in oz.)
9
2
8
12 ₇
1
Socket Lid: Black anodized Aluminum.
Thickness = 2.5mm.
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
3
Compression Plate: Black anodized Aluminum.
Thickness = 2.5mm.
4
Compression screw: Clear anodized Aluminum.
Thickness = 5mm, Hex socket = 5mm.
Elastomer: 20 micron dia gold plated brass
5
filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.5mm.
6
Elastomer Guide: Non-clad FR4.
Thickness = 0.475mm.
7 Ball Guide: Kapton polyimide.
Socket base screw: Socket head cap, alloy steel with
8 _{black oxide finish, 0-80 fine thread , 9.525mm long.}
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 _thread.
Customer's Target PCB
10 ^{Insulation Plate: FR4/G10, Thickness = 1.59mm.}
Backing Plate: Black anodized Aluminum.
11 _{Thickness = 6.35mm.}
12 ^{IC Guide: FR4}
SG-BGA-7003 Drawing
© 2009 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
Status: Released
Scale: -
Rev: D
Drawing: E Smolentseva
Date: 2/7/03
File: SG-BGA-7003 Dwg.mcd
Modified: 7/2/09, AE
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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