SG-BGA-6434 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

GHz BGA Socket - Epoxy mount, solderless
18.000±0.125
A
A
Features
3.05
•
1.25 _•
•
•
•
Directly mounts to target PCB.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Easily removable socket lid
TOP VIEW
0.21 (x4)
Recommended torque is 11.3 N-cm [1.0 lb-in]
9.3620
apply epoxy around
the socket base
SECTION A-A
14.457±0.125
15.207±0.125
Customer's target PCB
Description: Epoxy Mount Socket for 13mm x 13mm 15x15 0.8mm pitch BGA
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SG-BGA-6434 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 6.34
STATUS: Released
ENG: E. Smolentseva
FILE: SG-BGA-6434 Dwg
SHEET: 1 OF 5
DRAWN BY: M. Raske
DATE: 09/15/2015
REV. A
SCALE: 3.5:1