SG-BGA-6432 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Compression plate distributes forces evenly

19.125
A
GHz BGA Socket - Epoxy mount, solderless
Recommended torque
is 11.3 N-cm [1.0 lbf-in].
A
Features
• Directly mounts to target PCB (needs epoxy)
• High speed, reliable Elastomer connection
• Minimum real estate required
• Compression plate distributes forces evenly
• Easily removable socket lid
12.0000
6
4
Assembled
8.0mm +
IC thickness
1
3
2
11.4000
Epoxy
SECTION A-A
5
Description: GHz BGA Socket - Epoxy mount
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SG-BGA-6432 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 5.48
STATUS: Released
ENG: E. Smolentseva
FILE: SG-BGA-6432 Dwg
Socket Lid: Black anodized Aluminum.
1 Thickness = 2.5mm.
____________________________________
Socket Base: Black anodized Aluminum.
2 Thickness = 5mm.
____________________________________
Compression Plate: Black anodized Aluminum.
3 Thickness = 2.5mm.
____________________________________
Compression Screw: Clear anodized Aluminum.
4 Thickness = 5mm, Hex socket = 5mm.
____________________________________
Elastomer: 40 micron dia gold plated brass
5 filaments arranged symmetrically in a silicone
rubber (63.5 degree angle).
Thickness = 0.75mm.
____________________________________
Socket Lid Screw: Socket head cap, Stainless
6 Steel, 0-80 fine thread, 4.76mm long.
____________________________________
Note: Alignment guide for positioning socket
base to target PCB will be supplied.
SHEET: 1 OF 4
DRAWN BY: M. Raske
DATE: 07/22/2015
REV. A
SCALE: 3:1