SG-BGA-6427 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

A1 corner
A
55.00 heatsink size
GHz BGA Socket - Direct mount, solderless
Features
Recommended torque 36 in lb.
50.225
socket outline
A
• Directly mounts to target PCB (needs tooling holes) with hardware
• High speed, reliable Elastomer connection
• Minimum real estate required
• Compression plate distributes forces evenly
• Ball guide prevents over compression of elastomer
• Easily removable swivel socket lid
TOP
VIEW
52.725 backing plate
12.00 43.562
heatsink
10.00 fan
SECTION A-A
SCALE 1 : 1
customer's BGA device
SIDE
VIEW
11.71
customer's target PCB
Description: Elastomer socket for 45x45mm 44x44 1mm pitch BGA
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SG-BGA-6427 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 215.34
STATUS: Released
ENG: E. Smolentseva
FILE: SG-BGA-6427 Dwg
SHEET: 1 OF 5
DRAWN BY: M. Raske
DATE: 05/08/2015
REV. A
SCALE: 0.95:1