SG-BGA-6411 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

GHz BGA Socket - Direct mount, solderless
Features
24.225 SOCKET BASE
A
• Directly mounts to target PCB (needs tooling holes) with hardware
• High speed, reliable Elastomer connection
• Minimum real estate required
• Compression plate distributes forces evenly
• Ball guide prevents over compression of elastomer
• Easily removable swivel socket lid
A
TOP VIEW
26.725 BACKING PLATE
Recommended Torque:5.5- 6.0 in-lbs ( Full array)
Torque:4.0-4.5 in-lbs ( 500-550 pins)
10.130
5.801
4.588
SECTION A-A
3.000
Description: SG-BGA 19x19mm 0.75mm pitch 25x25 array
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SG-BGA-6411 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 19.31
STATUS: Approval Pending
ENG: V. Panavala
FILE: SG-BGA-6411 Dwg
SHEET: 1 OF 4
DRAWN BY: M. Raske
DATE: 4/23/2015
REV. -.01
SCALE: 5:2