SG-BGA-6401 Datasheet, PDF (1/5 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

GHz BGA Socket - Direct mount, solderless
Features
45
A
• Directly mounts to target PCB (needs tooling holes) with hardware
• High speed, reliable Elastomer connection
• Minimum real estate required
• Compression plate distributes forces evenly
• Ball guide prevents over compression of elastomer
• Easily removable swivel socket lid
A
Recommended torque on heat sink is 8 in. lb.
(see page 5 for instructions on assembly)
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13
1.6
5
SECTION A-A
Description: SG-BGA900 25x25mm 30x30 0.8mm Heat Sink
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SG-BGA-6401 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 79.80
STATUS: Released
ENG: B. Schatz
FILE: SG-BGA-6401 Dwg
SHEET: 1 OF 5
DRAWN BY: M. Raske
DATE: 02/17/2014
REV. A
SCALE: 5:4