SG-BGA-6392 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

55
HEAT-SINK
GHz BGA Socket - Direct mount, solderless
Features
• Directly mounts to target PCB (needs tooling holes) with hardware
• High speed, reliable Elastomer connection
• Minimum real estate required
• Compression plate distributes forces evenly
• Ball guide prevents over compression of elastomer
D
• Easily removable swivel socket lid
D
TOP VIEW
Instructions:
1. If attached, remove fan from heat sink assembly
2. Apply 2 in lb torque to the compression screw,
3. Attach fan to heat sink / compression screw assembly.
10
35.307
10
12.5
SECTION D-D
FRONT VIEW
Description: GHz socket for 15.5x24mm, 15x23 array 1mm pitch
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all
other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SG-BGA-6392 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 117.21
30.225
32.725
STATUS: Released
ENG: B. Schatz
FILE: SG-BGA-6392 Dwg
SHEET: 1 OF 4
DRAWN BY: M. Raske
DATE: 10/29/2013
REV. B
SCALE: 1.2:1