SG-BGA-6383 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

GHz BGA Socket - Direct mount, solderless
Features
• Directly mounts to target PCB (needs tooling holes) with hardware
• High speed, reliable Elastomer connection
• Minimum real estate required
• Compression plate distributes forces evenly
• Ball guide prevents over compression of elastomer
• Easily removable swivel socket lid
17.225
19.500
Recommended torque = 1 in lbs.
2.538
11.255
16.580
Description: SG-BGA 12mm IC, 11x11 array, 1mm pitch
Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.
Tolerances: Hole diameters ±0.0254mm [±0.001"], Pitches (from true position) ±0.0762mm [±0.003"], substrate thickness tolerance ±10%, all
other tolerances ±0.127mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.
SG-BGA-6383 Drawing
Ironwood Electronics, Inc.
Tele: [phone]
www.ironwoodelectronics.com
Material: N/A
Finish: N/A
Weight: 7.61
STATUS: Released
ENG: M. A. Fedde
FILE: SG-BGA-6383
SHEET: 1 OF 4
DRAWN BY: D. Hauer
DATE: 05/20/13
REV. A
SCALE: 3:1