SG-BGA-6379 Datasheet, PDF (1/4 Pages) Ironwood Electronics. – Ball guide prevents over compression of elastomer

Top View
GHz BGA Socket - Direct mount, solderless
32.225mm
Features
Directly mounts to target PCB (needs tooling holes) with hardware.
High speed, reliable Elastomer connection
Minimum real estate required
Compression plate distributes forces evenly
Ball guide prevents over compression of elastomer
Easily removable swivel socket lid
A
1
Assembled
8.25mm +
IC thickness
12
32.225mm
Side View
(Section AA)
10
6
Customer's
BGA IC
SG-BGA-6379 Drawing
© 2013 IRONWOOD ELECTRONICS, INC.
Tele: [phone]
www.ironwoodelectronics.com
4
3
5
A
Recommended torque = 59 in lbs./
81044ininozo.z.
9
2
8
7
11
Customer's Target PCB
Socket Lid: Black anodized Aluminum.
1 _{Thickness = 2.5mm.}
2
Socket base: Black anodized Aluminum.
Thickness = 5mm.
Compression Plate: Black anodized Aluminum.
3 _{Thickness = 2.5mm.}
Compression screw: Clear anodized Aluminum.
4 _{Thickness = 5mm, Hex socket = 5mm.}
Elastomer: 40 micron dia gold plated brass
filaments arranged symmetrically in a silicone
5 _{rubber (63.5 degree angle).}
Thickness = 0.75mm.
Elastomer Guide: Non-clad FR4.
6 _{Thickness = 0.725mm.}
7 ^{Ball Guide: Kapton polyimide.}
Socket base screw: Fillister head, Alloy steel with
8 black oxide finish, 0-80 fine thread , 12.7mm long.
Socket lid screw: Shoulder screw, 18-8 SS, 0-80 fine
9 _thread.
10 ^{Insulation Plate: FR4/G10, 1.59mm thick.}
11 ^{Backing Plate: Anodized Aluminum 6.35mm thick.}
12 ^{IC Frame: Ultem 1000.}
Status: Released
Drawing: M.A. Fedde
File: SG-BGA-6379 Dwg
Scale: 3:1
Rev: A
Date: 04/03/2013
Modified:
All tolerances: ±0.125mm (unless stated
otherwise). Materials and specifications
are subject to change without notice.
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